IBM and Lam Research Announce Collaboration to Advance Sub-1nm Logic Scaling
MWN-AI** Summary
On March 10, 2026, IBM (NYSE: IBM) and Lam Research Corp. (NASDAQ: LRCX) announced a significant collaboration focused on advancing sub-1nm logic scaling. This partnership extends their decade-long successful alliance, targeting the development of innovative materials, advanced fabrication processes, and High NA EUV lithography techniques necessary for the next generation of semiconductors.
Under a new five-year agreement, IBM and Lam aim to develop solutions that will enhance the efficiency and performance of future logic nodes. Their joint efforts will concentrate on creating specialized materials, refining etching and deposition capabilities for complex device architectures, and advancing High NA EUV lithography processes. These developments are crucial for the industry, particularly as it transitions into 3D scaling technologies vital for high-performance computing and artificial intelligence applications.
Mukesh Khare, IBM's GM of Semiconductors, highlighted the significance of Lam's contributions over the past decade, which have facilitated major breakthroughs including the creation of nanosheets and the unveiling of the first 2nm node chip in 2021. Lam's chief technology officer, Vahid Vahedi, echoed this sentiment, stressing the need for an integrated approach combining materials, processes, and lithography for developing high-density systems that will support future transistor technologies.
Leveraging IBM’s advanced research facilities at the Albany NanoTech Complex and Lam’s comprehensive range of process tools—including Aether® dry resist technology and advanced deposition systems—the collaboration intends to expedite the transition from theoretical to practical applications. This innovative partnership is positioned to enable reliable mass production of next-generation logic devices, crucial for maintaining momentum in the semiconductor industry amidst growing demands for lower power consumption and enhanced performance.
MWN-AI** Analysis
The recent collaboration between IBM (NYSE: IBM) and Lam Research (NASDAQ: LRCX) to advance sub-1nm logic scaling represents a strategic move that could significantly influence both companies' market trajectories. This partnership, rooted in over a decade of successful cooperation, aims to innovate materials and advanced processes essential for next-generation semiconductor technologies, which are pivotal as industries increasingly gravitate towards AI and high-performance computing.
For investors, this collaboration highlights key aspects worth monitoring. Firstly, the focus on sub-1nm scaling could yield substantial competitive advantages in semiconductor manufacturing, enabling both IBM and Lam to remain at the forefront of technological advancements. The ability to produce smaller, more efficient chips directly correlates with elevated performance indicators and lower energy consumption, which are critical in sectors such as AI and cloud computing.
Moreover, Lam Research's established position as a supplier of semiconductor fabrication equipment reinforces the expectation of sustained demand growth in the semiconductor sector, particularly with the global push for advanced computing capabilities. As such, Lam’s stock may present a favorable risk-reward outlook, particularly given its essential role in the fabrication processes that underpin the semiconductor industry's future.
From an investment perspective, this partnership reinforces IBM's credibility as a technology leader and its ongoing commitment to hybrid cloud and AI solutions, which could leverage this technological advancement in its broader business strategy. For investors seeking exposure to the semiconductor market, both IBM and Lam Research could be viewed as solid long-term investments, particularly if they can demonstrate the successful commercialization of sub-1nm technology.
In conclusion, investors would be prudent to follow developments from this collaboration closely, as successful execution may solidify both companies' positions in an increasingly competitive landscape, with potential upside in their stock valuations.
**MWN-AI Summary and Analysis is based on asking OpenAI to summarize and analyze this news release.
PR Newswire
Agreement includes development of novel materials, advanced processes, and High NA EUV lithography techniques to enable future logic nodes
ALBANY, N.Y. and FREMONT, Calif., March 10, 2026 /PRNewswire/ -- IBM (NYSE: IBM) and Lam Research Corp. (NASDAQ: LRCX) today announced a collaboration aimed at developing new processes and materials to support sub-1nm logic scaling. Building on a long record of successful partnerships, the new agreement will focus on the joint development of novel materials, fabrication processes, and High NA EUV lithography processes to advance IBM's logic scaling roadmap.
IBM and Lam have collaborated for more than a decade to advance logic fabrication, notably enabling early generations of 7nm, nanosheet, and EUV process technologies. Under this new five-year agreement, the companies intend to extend logic scaling to the sub-1nm node. The work will focus on developing new materials, advanced etch and deposition capabilities for increasingly complex device architectures, and new High NA EUV lithography processes to enable next-generation interconnect and device patterning and accelerate industry adoption.
"Lam has been a critical partner to IBM for over a decade, contributing to key breakthroughs in logic scaling and device architecture such as nanosheet and the world's first 2nm node chip, unveiled by IBM in 2021," said Mukesh Khare, GM of IBM Semiconductors and VP of hybrid cloud, IBM Research. "We are thrilled to be expanding our collaboration to tackle the next set of challenges to enable High NA EUV lithography and sub-1nm nodes."
"As the industry enters a new era of 3D scaling, progress depends on rethinking how materials, processes, and lithography come together as a single, high-density system," said Vahid Vahedi, chief technology and sustainability officer at Lam Research. "We are proud to build on our successful collaboration with IBM to drive High?NA EUV dry resist and process breakthroughs, accelerating the development of lower power and higher performance transistors that will be critical for AI era."
Using IBM's advanced research capabilities at the NY Creates Albany NanoTech Complex and Lam's end-to-end process tools and innovations — including Aether® dry resist technology, Kiyo® and Akara® etch platforms, Striker® and ALTUS® Halo deposition systems, and advanced packaging technologies — the teams will build and validate full process flows for nanosheet and nanostack devices and backside power delivery. Together, these capabilities are aimed at allowing High?NA EUV patterns to be reliably transferred into real device layers with high yield and enabling continued scaling, improved performance, and viable paths to production for future logic devices.
About Lam Research
Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's equipment and services allow customers to build smaller and better-performing devices. In fact, today, nearly every advanced chip is built with Lam technology. We combine superior systems engineering, technology leadership, and a strong values-based culture, with an unwavering commitment to our customers. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, Calif., with operations around the globe. Learn more at www.lamresearch.com.
About IBM
IBM is a leading global provider of hybrid cloud and AI, and consulting expertise. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. Thousands of government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on IBM's hybrid cloud platform and Red Hat OpenShift to affect their digital transformations quickly, efficiently and securely. IBM's breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and consulting deliver open and flexible options to our clients. All of this is backed by IBM's long-standing commitment to trust, transparency, responsibility, inclusivity and service. Visit www.ibm.com for more information.
IBM Contact
Willa Hahn
IBM Research communications
willa.hahn@ibm.com
Lam Research Contacts
Laura Bakken
Lam Research Media Relations
+1 (510) 572-9021
laura.bakken@lamresearch.com
Ram Ganesh
Investor Relations
+1 (510) 572-1615
investor.relations@lamresearch.com
SOURCE Lam Research Corporation
FAQ**
How will the collaboration between International Business Machines Corporation IBM and Lam Research impact the competitive landscape of semiconductor manufacturing in the context of sub-1nm logic scaling?
What specific technological advancements do International Business Machines Corporation IBM and Lam Research aim to achieve through their joint development of High NA EUV lithography processes?
In what ways could the advancements in materials and processes by International Business Machines Corporation IBM and Lam Research benefit the energy efficiency and performance of future semiconductor devices?
How does this new five-year agreement between International Business Machines Corporation IBM and Lam Research build on their previous successes in advancing logic fabrication technologies?
**MWN-AI FAQ is based on asking OpenAI questions about International Business Machines Corporation (NYSE: IBM).
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