CAMT - Camtek nabs $20M in Advanced Interconnect Packaging orders from tier-1 IDMs

Camtek (NASDAQ:CAMT) trades 4.8% higher premarket after it received orders worth ~$20M from 2 leading tier-1 IDMs; the systems will be used for inspection and 3D metrology of the most technologically challenging applications. The orders are for the Advanced Interconnect Packaging, the company's current major growth driver. "The Advanced Interconnect Packaging market continues to grow with complex packaging technologies such as Heterogeneous Integration supporting the most challenging applications, mainly high-performance computing. Our customers are able to leverage our expertise and long experience to meet their requirements and support the manufacture of the high-end applications," CEO Rafi Amit commented.

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Camtek nabs $20M in Advanced Interconnect Packaging orders from tier-1 IDMs