KLIC - Kulicke & Soffa expands thermal bonding capabilities with integration of semiconductor and silicon photonics

Kulicke and Soffa Industries (NASDAQ:KLIC) is expanding its thermal compression bonding capabilities to accelerate innovation in the integration of semiconductor and silicon photonics. During its Q1 2022, the company successfully received acceptance and recognized revenue for a high-potential Silicon Photonics application which supports the emerging optical transceiver market. Optical transceivers represent a new market opportunity for K&S and are anticipated to grow at a 50% CAGR through 2025, supporting the growing need for increased global connectivity in data centers and HPC applications.

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Kulicke & Soffa expands thermal bonding capabilities with integration of semiconductor and silicon photonics