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home / news releases / SSNLF - Micron: Benefiting From Strong AI-Based HBM Packaging Growth


SSNLF - Micron: Benefiting From Strong AI-Based HBM Packaging Growth

2024-06-27 12:46:43 ET

Summary

  • Micron announced fiscal Q3 earnings on June 26, but guidance was in-line with consensus, questioning the rationale for explosive share growth in the past three months.
  • My analysis shows HBM market to grow from 4% to 15% of global advanced semiconductor packaging market by 2028, with Micron gaining share.
  • I expect Micron's HBM capacity to increase from 5.6% in Q1 2024 to 14.0% in Q4 2025, positioning the company as the fastest growing in the DRAM oligopoly.

Earnings Call Analysis

Micron ( MU ) announced its fiscal Q3 earnings on Wednesday June 26. The shares dropped 6.5% in extended-hours trading on Wednesday after the memory chipmaker issued guidance that was in-line with estimates, and are down 6% in the late-morning of June 27....

For further details see:

Micron: Benefiting From Strong AI-Based HBM Packaging Growth
Stock Information

Company Name: Samsung Electronics Co Ltd
Stock Symbol: SSNLF
Market: OTC
Website: samsung.com

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