UMC - UMC and Cadence join hands on 3D-IC hybrid bonding reference flow

• United Microelectronics ( NYSE: UMC ) and Cadence Design Systems ( NASDAQ: CDNS ) collaborate on the Cadence ^® 3D-IC reference flow, featuring the Integrity ^™ 3D-IC Platform, certified for UMC’s chip stacking technologies.
• Using UMC’s 40nm low power process as a wafer-on-wafer stacking demonstration, the two companies collaborated to validate key 3D-IC features in this design flow, including system planning and intelligent bump creation with Cadence’s Integrity 3D-IC platform.
• The platform offers design planning, implementation and analysis of full 3D designs within a single, unified cockpit.
• The reference flow also enables system-level layout versus schematic checking to connectivity accuracy, electric rule-checking for coverage and alignment checking, and thermal analysis for heat distribution in a 3D stacked-die design structure.
• Shares of UMC are down 1.60% after-hours on Tuesday.

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