XPER - Xperi and LAPIS sign a Hybrid Bonding license agreement

Adeia, the newly launched brand for the intellectual property licensing business of Xperi (NASDAQ:XPER) and LAPIS Technology, ROHM Group subsidiary, signed a agreement which includes technology transfer of Adeia's DBI Ultra die-to-wafer hybrid bonding know-how to support the development and deployment of the technology into LAPIS’s product portfolio. The agreement also includes a license to Adeia's foundational hybrid bonding patent portfolio. Adeia has pioneered fundamental advances in the semiconductor industry over the last 30 years.

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Xperi and LAPIS sign a Hybrid Bonding license agreement