XPER - Xperi inks multi-year deal with Micron Tech for hybrid bonding

Xperi (NASDAQ:XPER) entered into a multi-year deal with Micron Technology (NASDAQ:MU), under which MU will have access to XPER's IP licensing business Adeia’s hybrid bonding IP to enhance next generation memory devices. “We are thrilled to extend our relationship with Micron, providing access to our broad semiconductor intellectual property portfolio, including our foundational hybrid bonding innovations,” said Jon Kirchner, CEO, Xperi. With a large and growing portfolio of intellectual property covering hybrid bonding, semiconductor packaging and semiconductor processing technologies, Adeia licenses and partners with semiconductor companies around the world.

For further details see:

Xperi inks multi-year deal with Micron Tech for hybrid bonding