TSEM - Tower Semiconductor Teramount enter technology collaboration

2023-03-06 06:50:03 ET

• Tower Semiconductor ( NASDAQ: TSEM ) has announced a technology collaboration with Teramount to offer solution to enable differentiated optical solutions.
• The partnership is based on Teramount's 'PhotonicPlug' technology and Tower's silicon photonic 'Bump-ready' wafers.
• Bump-ready wafers combine Tower's high-volume PH18 silicon photonic technology with features that enable the simultaneous connection of a large number of fibers to the chip. This significantly simplifies assembly into a final high-speed data transport solution for datacenters and telecom networks, as well as new emerging applications in artificial intelligence ( AI ) and sensors.
• The companies plan to offer this capability to customers who need silicon photonics solutions for devices ranging from transceivers to high-bandwidth switches as well as Co-Packaged Optics for networking and advanced computing applications.

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