BOS Semiconductors Selects Ceva's AI DSP for Next-Generation ADAS Platforms
MWN-AI** Summary
BOS Semiconductors has selected Ceva, Inc.'s SensPro AI DSP architecture for its next-generation Eagle-A standalone ADAS System-on-Chip (SoC), as announced during CES 2026. This collaboration comes as the automotive industry gravitates towards advanced driver assistance systems (ADAS) and autonomous driving technologies, necessitating enhanced real-time sensor processing and safety-critical intelligence.
The Eagle-A chip is engineered to support complex tasks in autonomous driving, integrating high-performance processing units, including a Neural Processing Unit (NPU), CPU, and GPU, with specialized interfaces for camera, LiDAR, and radar data fusion. Ceva's SensPro architecture is particularly optimized for the pre-processing of LiDAR and radar information, facilitating rapid data handling that minimizes latency—crucial for effective perception in autonomous vehicles.
The modular nature of the Eagle series allows for flexibility and scalability, enabling automotive OEMs to customize computing capabilities according to various driving requirements. This design also extends the potential applications of BOS’s SoC technology into sectors like robotics and drones.
BOS Semiconductors, founded in 2022 by Dr. Jaehong Park, has quickly garnered recognition in the industry, being listed as a National Strategic Technology Enterprise by the Korean government. The company is presently working on multiple projects, including the Eagle-N AI Accelerator, aiming to push the boundaries of automotive AI.
Ceva's engagement with BOS underscores the growing importance of AI DSP technologies in the automotive realm, reinforcing its robustness in providing essential AI-driven solutions. Both companies express confidence that the partnership will accelerate the development of safer, smarter vehicles tailored for the software-defined era.
MWN-AI** Analysis
The selection of Ceva's SensPro AI DSP technology by BOS Semiconductors for its Eagle-A ADAS System-on-Chip (SoC) represents a significant milestone in the automotive semiconductor industry, particularly in the rapidly advancing field of autonomous driving technologies. Investors should note that this partnership aligns with several key trends that are expected to enhance the valuation and growth trajectory of both companies.
First, the automotive industry is undergoing a transformation towards software-defined vehicles, which necessitates advanced processing capabilities for real-time sensor fusion involving technologies like LiDAR and radar. The integration of Ceva's DSP capabilities will likely improve the performance and safety of ADAS solutions, setting BOS apart in a competitive market. This differentiation could lead to increased market share and potentially attract high-profile OEM partnerships.
Moreover, the modular design and chiplet strategy employed by BOS promise scalability and adaptability, which are critical attributes for addressing diverse customer needs. This facet will not only bolster BOS's position in automotive applications but can also expand its reach into adjacent markets such as robotics and drones, further diversifying revenue streams.
For investors, Ceva's involvement enhances its reputation and strengthens its portfolio in the auto-tech sector. Those looking for exposure to burgeoning AI-driven markets might consider taking positions in Ceva (NASDAQ: CEVA) as it continues leveraging its IP for various applications across the intelligent edge.
However, it is essential to monitor potential risks associated with technological advancements, regulatory changes in the automotive space, and the cyclicality of the semiconductor industry. Investors should also consider market valuations and overall sector sentiment. Staying informed about the evolution of these companies and their partnerships will be crucial to making well-timed investment decisions in this dynamic landscape.
**MWN-AI Summary and Analysis is based on asking OpenAI to summarize and analyze this news release.
PR Newswire
Eagle-A leverages SensPro™ to accelerate LiDAR and radar sensing workloads for real-time perception and sensor fusion
LAS VEGAS , Jan. 6, 2026 /PRNewswire/ -- As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor processing, safety-critical intelligence, and physical AI to bridge perception and actuation. In line with this trend, Ceva, Inc. (NASDAQ: CEVA) today announced that BOS Semiconductors has licensed its SensPro™ AI DSP architecture for the Eagle-A standalone ADAS System-on-Chip (SoC).
Eagle-A is designed for advanced driver assistance and autonomous driving systems, combining a high-end NPU, CPU and GPU with dedicated sensing interfaces for camera, LiDAR, and radar fusion. Ceva's SensPro AI DSP is optimized for LiDAR and radar pre-processing, enabling efficient handling of raw sensor data and reducing latency in perception pipelines. BOS Semiconductors' chiplet strategy further enhances scalability, with Eagle-A designed to work alongside the Eagle-N AI accelerator in multi-die configurations connected via UCIe and PCIe. This approach enables OEMs to tailor compute performance for diverse ADAS and autonomous driving requirements. In addition, the modular design of BOS's Eagle series enables flexible deployment across edge AI applications beyond automotive, such as robotics and drones.
"Eagle-A is a next-generation SoC developed with BOS' differentiated technology, delivering domain-level compute performance, safety, and scalability optimized for ADAS applications. Ceva's SensPro AI DSP plays an important role in realizing these design goals and is expected to efficiently support complex sensing workloads," said Jason Chae, Chief Sales & Marketing Officer at BOS Semiconductors. He added, "Eagle-A integrates data from cameras, LiDAR, and radar in real time to enable accurate perception for autonomous driving, further reinforcing BOS' competitiveness in automotive AI."
"BOS Semiconductors is driving a bold vision for next-generation ADAS, and we're proud to support that journey," said Yaron Galitzky, Executive Vice President, AI Division at Ceva. "Their adoption of SensPro underscores the critical role of AI DSPs for advanced sensing in ADAS and strengthens Ceva's position in the rapidly expanding automotive market. This collaboration is highly synergistic with our AI and sensing capabilities, enabling safer, smarter vehicles."
Ceva's SensPro architecture is optimized for sensor processing, AI inference, and control algorithms, delivering exceptional performance per watt while meeting the stringent power and safety requirements of automotive applications. For more information, visit https://www.ceva-ip.com/product/ceva-senspro2/
About BOS Semiconductors
Founded in 2022 by Dr. Jaehong Park, former Executive Vice President at Samsung Foundry, BOS Semiconductors is a Korea-based fabless company pioneering next-generation system-on-chip (SoC) solutions for the automotive industry. With operations in Korea, Vietnam, Germany, and the United States, the company is powered by a team of senior engineers with over 20 years of experience, who have successfully led multiple global SoC projects. BOS has been officially recognized by the Korean government as a National Strategic Technology Enterprise and was recently selected as the lead organization for the national R&D project "AI Accelerator Semiconductor Development for Software-Defined Vehicles (SDV)."
The company is currently developing the Eagle-N AI Accelerator and the Eagle-A one-chip ADAS SoC, driving innovation in automotive AI and intelligent mobility for the era of software-defined vehicles. For more information, visit https://www.bos-semi.com/.
About Ceva, Inc.
Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.
With more than 20 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today's most advanced smart edge products - from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra–low–power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva's IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.
Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.
SOURCE Ceva, Inc.
FAQ**
How does the collaboration between BOS Semiconductors and CEVA Inc. CEVA enhance the performance and efficiency of the Eagle-A ADAS SoC in terms of real-time sensor processing?
What specific advantages does CEVA Inc. CEVA's SensPro AI DSP architecture provide for LiDAR and radar workloads in the context of next-generation ADAS applications?
In what ways does BOS Semiconductors' chiplet strategy, alongside CEVA Inc. CEVA's technology, contribute to scalability for diverse ADAS and autonomous driving requirements?
How does the partnership between BOS Semiconductors and CEVA Inc. CEVA position both companies within the rapidly expanding automotive AI market, particularly in the context of software-defined vehicles?
**MWN-AI FAQ is based on asking OpenAI questions about CEVA Inc. (NASDAQ: CEVA).
NASDAQ: CEVA
CEVA Trading
-4.09% G/L:
$18.165 Last:
102,878 Volume:
$18.83 Open:
