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Interlink Electronics Awarded $175,000 USDA SBIR Grant to Develop AI-Powered Food Quality & Safety Monitor

MWN-AI** Summary

Interlink Electronics, Inc. (NASDAQ: LINK), renowned for its innovations in sensor technology, has secured a $175,000 Phase I grant from the U.S. Department of Agriculture (USDA) under the Small Business Innovation Research (SBIR) program. This funding is designated for the development of an AI-driven post-harvest food quality and safety monitoring system. As supply chains become increasingly complex, the need for effective food safety measures is paramount, merging economic imperatives with public health concerns.

The proposed system aims to utilize Interlink's advanced electrochemical gas sensing technology coupled with proprietary data analytics to monitor produce quality in real-time. By integrating artificial intelligence, the company seeks to provide a comprehensive solution for assessing freshness and detecting spoilage risks before products reach consumers. Dr. Sreeni Rao, Vice President of Product Management, emphasized the potential of their technology to convert raw data into actionable insights that enhance food security and minimize waste along the supply chain.

Chairman and CEO Steven N. Bronson highlighted the strategic importance of the USDA award, stating that the sensors serve as essential tools in the burgeoning AI landscape. The funding not only reaffirms Interlink's commitment to innovation but also reinforces its position as a pivotal player in AI applications within environmental and agricultural monitoring.

Looking ahead, this Phase I project could pave the way for future Phase II funding and eventual commercialization, indicating strong prospects for Interlink's growth in the AI-driven market. With over four decades of industry presence, the company continues to develop solutions that meet the demands of a diverse range of sectors, from medical to industrial applications, positioning itself as a leader in sensor technology worldwide.

MWN-AI** Analysis

Interlink Electronics, Inc. (NASDAQ: LINK) has recently secured a $175,000 SBIR grant from the USDA to develop an AI-powered food quality and safety monitoring system, spotlighting its innovative approaches in sensor technology. This initiative marks a significant step towards enhancing food supply chain integrity, making Interlink a player to watch in both the agricultural and AI sectors.

From a market perspective, this grant signals the potential for Interlink to emerge as a leader in AI-driven agricultural technologies, specifically in enhancing food safety — a growing concern for consumers and regulators alike. The fusion of advanced electrochemical sensing and AI could revolutionize how produce is monitored throughout its journey from farm to table, addressing critical issues of waste and foodborne illnesses.

For investors, this development indicates several key points of interest. First, the successful acquisition of government funding reflects confidence in Interlink's technology and its capacity to innovate. The company’s commitment to research and development is underscored by its ability to secure grants, which may enhance its future growth trajectory and investor return potential. Additionally, the growing awareness and concern around food safety create a ripe market for technologies like the one Interlink is developing.

However, investors should also note the inherent risks cited in Interlink's forward-looking statements, including competition, technological advancements, and market acceptance of new products. The company's success in navigating these challenges will be pivotal.

In conclusion, as Interlink Electronics embarks on its latest project backed by a government grant, it offers a compelling investment opportunity, particularly for those looking to engage with companies at the intersection of technology and sustainability. Monitoring their progress and subsequent funding phases will be essential for gauging long-term investment potential.

**MWN-AI Summary and Analysis is based on asking OpenAI to summarize and analyze this news release.

Source: GlobeNewswire

FREMONT, Calif., Sept. 09, 2025 (GLOBE NEWSWIRE) -- Interlink Electronics, Inc. (NASDAQ: LINK), a global leader in sensor technology and printed electronic solutions, today announced that its Gas and Environmental Solutions division has been awarded a $175,000 Small Business Innovation Research (SBIR) Phase I grant from the U.S. Department of Agriculture (USDA). The grant will fund development of an AI-powered post-harvest food quality and safety monitoring system, leveraging Interlink’s advanced electrochemical gas sensing platform and proprietary data analytics.

As food supply chains grow more complex, ensuring freshness and safety from farm to table has become both an economic necessity and a global public health imperative. By fusing real-time gas detection with artificial intelligence, Interlink aims to deliver a breakthrough system capable of continuously assessing produce quality, detecting spoilage risks, and enabling actionable interventions before food reaches consumers.

“This award underscores the innovation behind Interlink’s technology and our ability to deliver scalable, low-power, and cost-efficient sensors that generate the high-fidelity data AI systems require,” said Dr. Sreeni Rao, Vice President of Product Management at Interlink Electronics. “By pairing our sensors with advanced AI, we can transform raw data into intelligent insights that strengthen food security, improve safety, and reduce waste across the supply chain.”

Steven N. Bronson, Interlink’s Chairman and CEO, added: “Sensors are the ‘picks and shovels’ of the AI revolution. By integrating our sensor technologies with artificial intelligence, we are expanding Interlink’s role as a foundational enabler of AI-driven applications. This USDA award builds on our successful track record of securing government grants, validates the strength of our R&D roadmap, and advances our mission of addressing global challenges with sensor intelligence.”

The Phase I project lays the groundwork for potential Phase II funding and future commercialization, positioning Interlink at the forefront of AI-driven environmental and agricultural monitoring.

About Interlink Electronics, Inc.
Interlink Electronics is a leading provider of sensors and printed electronic solutions, boasting 40 years of success in delivering mission-critical technologies across diverse markets. Our customers, including global blue-chip companies, trust our products and solutions, which span various markets, including medical, industrial, automotive, wearables, IoT, and other specialty markets. Our expertise in materials science, manufacturing, embedded electronics, firmware, and software enables us to create custom solutions tailored to our customers’ unique needs.

We serve our international customer base from our corporate headquarters and proprietary gas sensor production and product development facility in Fremont, California (Silicon Valley area); our Global Product Development and Materials Science Center and distribution and logistics center in Camarillo, California; and our advanced printed-electronics manufacturing facilities in Shenzhen, China; Irvine, Scotland; and Barnsley, England. For more information, please visit www.InterlinkElectronics.com .

Forward Looking Statements
This release contains “forward-looking statements” within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements can be generally identified by phrases such as “thinks,” “anticipates,” “believes,” “estimates,” “expects,” “intends,” “plans,” and similar words. Forward-looking statements in this press include statements about our acquisition program, our projected revenue and earnings growth, and the effects of recent acquisitions, including contributions to our products, manufacturing operations and the markets we serve. Forward-looking statements are not guarantees of future performance and are inherently subject to uncertainties and other factors which could cause actual results to differ materially from the forward-looking statement. These statements are based upon, among other things, assumptions made by, and information currently available to, management, including management’s own knowledge and assessment of the company’s industry, R&D initiatives, competition and capital requirements. Other factors and uncertainties that could affect the company’s forward-looking statements include, among other things, the following: our success in predicting new markets and the acceptance of our new products; efficient management of our infrastructure; the pace of technological developments and industry standards evolution and their effect on our target product and market choices; the effect of outsourcing technology development; changes in the ordering patterns of our customers; a decrease in the quality and/or reliability of our products; protection of our proprietary intellectual property; competition by alternative sophisticated as well as generic products; continued availability of raw materials for our products at competitive prices; disruptions in our manufacturing facilities; risks of international sales and operations including fluctuations in exchange rates; compliance with regulatory requirements applicable to our manufacturing operations; and customer concentrations. Additional factors that could cause actual results to differ materially from those anticipated by our forward-looking statements are under the captions “Risk Factors” and “Management’s Discussion and Analysis of Financial Condition and Results of Operations” in our most recent Annual Report (Form 10-K) or Quarterly Report (Form 10-Q) filed with the Securities and Exchange Commission. Forward-looking statements are made as of the date of this release, and we expressly disclaim any obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events or otherwise.

Company Contact:
Interlink Electronics, Inc.
Steven N. Bronson, CEO
LINK@IESensors.com
805-623-4184

Investor Relations Contact:
Gateway Group, Inc.
Matt Glover and Clay Liolios
LINK@IESensors.com
949-574-3860


FAQ**

How does Interlink Electronics Inc. LINK plan to leverage the $175,000 SBIR Phase I grant to enhance its AI-powered post-harvest food quality monitoring system and what are the expected outcomes of this initiative?

Interlink Electronics Inc. plans to use the $175,000 SBIR Phase I grant to advance its AI-driven post-harvest food quality monitoring system by enhancing its technology, optimizing data analytics, and improving food safety, with outcomes aimed at increased market adoption and reduced food waste.

What competitive advantages does Interlink Electronics Inc. LINK anticipate from integrating its advanced electrochemical gas sensing technology with AI in the food safety sector?

Interlink Electronics Inc. anticipates that integrating its advanced electrochemical gas sensing technology with AI in the food safety sector will enhance real-time monitoring, improve accuracy in detecting spoilage, and enable predictive analytics for better quality control.

Given the focus on food safety, how does Interlink Electronics Inc. LINK intend to address potential regulatory challenges posed by the USDA and other agencies in the commercialization of its new technology?

Interlink Electronics Inc. plans to address potential regulatory challenges from the USDA and other agencies by actively engaging with regulators, ensuring compliance with food safety standards, and leveraging its technology to enhance traceability and transparency in food supply chains.

As Interlink Electronics Inc. LINK prepares for potential Phase II funding, what milestones does the company aim to achieve to ensure the success of its AI-driven environmental and agricultural monitoring projects?

Interlink Electronics Inc. aims to achieve successful prototype development, secure strategic partnerships, demonstrate measurable environmental impact, and establish a robust market acceptance framework to ensure the success of its AI-driven monitoring projects ahead of Phase II funding.

**MWN-AI FAQ is based on asking OpenAI questions about Interlink Electronics Inc. (NASDAQ: LINK).

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