NXP's New i.MX 93W Fuses Edge Compute and Secure Wireless Connectivity to Accelerate Physical AI
MWN-AI** Summary
NXP Semiconductors has unveiled the i.MX 93W applications processor, designed to enhance the deployment of physical AI applications by integrating a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This innovative system-on-chip (SoC) is the first of its kind in the industry, allowing users to replace up to 60 discrete components with a single package, which streamlines design and reduces costs.
Targeted toward smart IoT, healthcare, and industrial applications, the i.MX 93W accelerates the deployment of coordinated AI agents that can operate in real-time. These agents can manage various devices to optimize operations, such as enhancing energy efficiency in smart buildings or synchronizing healthcare wearables for better patient monitoring. By combining edge compute capabilities, AI acceleration, and secure connectivity, the i.MX 93W facilitates rapid scaling of AI applications across diverse environments.
Additionally, NXP's pre-certified reference designs significantly reduce the complexity typically associated with wireless certification and RF integration, further speeding up time-to-market. The processor features a dual-core Arm Cortex-A55 and an integrated IW610 tri-radio that supports Wi-Fi 6, Bluetooth Low Energy, and a 802.15.4 connectivity protocol for seamless operation.
Robust security measures are embedded with the EdgeLock Secure Enclave, which addresses regulatory requirements and provides secure boot, device attestation, and secure access. The i.MX 93W is expected to begin sampling in the second half of 2026, positioning NXP at the forefront of the physical AI revolution and providing customers with a powerful, integrated solution that simplifies deployment and accelerates development timelines.
MWN-AI** Analysis
NXP Semiconductors' recent introduction of the i.MX 93W applications processor marks a significant advancement in the embedded systems market, particularly in the realm of physical AI and IoT applications. By integrating a dedicated AI neural processing unit (NPU) with tri-radio wireless connectivity, this SoC reduces system complexity, offering a compelling value proposition for developers looking to streamline their designs and accelerate time-to-market.
From an investment perspective, NXP's strategic focus on simplifying the deployment of physical AI solutions aligns with the growing demand for smart, interconnected devices across various industries. The i.MX 93W enables manufacturers to replace up to 60 discrete components with a single package, which not only reduces costs but also minimizes the risk associated with RF integration and certification. As the need for efficient and secure AI deployment in sectors like healthcare, industrial automation, and smart buildings increases, NXP is well-positioned to capture market share.
The pre-certified reference designs that accompany the i.MX 93W will further expedite the route to commercialization for companies developing AI implementations. This ease of integration is critical in keeping pace with competitors in the fast-evolving tech landscape. Moreover, the security features instilled via the EdgeLock Secure Enclave enhance the attractiveness of the i.MX 93W, addressing consumer and regulatory concerns around data protection.
Investors should consider NXP’s potential for growth, as this new SoC provides a scalable solution that meets the expectations of increasingly sophisticated IoT applications. As companies shift focus towards integrated, AI-aware solutions, NXP's innovations could position the company favorably for future revenue increases, making it a compelling candidate for investment in the semiconductor space.
**MWN-AI Summary and Analysis is based on asking OpenAI to summarize and analyze this news release.
- First applications processor to combine an AI NPU with secure, tri-radio connectivity, replacing up to 60 discrete components with a single package
- Accelerates coordinated AI agent deployment with integrated edge compute and secure connectivity, supported by NXP software and eIQ® AI enablement
- Pre-certified designs simplify wireless certification, eliminating RF complexity and speeding time-to-market
NUREMBERG, Germany, March 09, 2026 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, the i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 discrete components with a single package. Pre-certified reference designs eliminate many common integration challenges, reducing the complexity, cost and risk traditionally associated with RF design. Supported by NXP’s software and industry-leading eIQ AI enablement solutions, the i.MX 93W also supports smaller form factors and is designed to accelerate time-to-market for physical AI applications.
Physical AI requires coordinated AI agents to collaborate locally, taking real-time action with low latency and high reliability. For example, AI agents might coordinate across a smart building’s lighting, HVAC, access control, occupancy and smart energy systems to autonomously optimize comfort, energy efficiency, and operational responsiveness securely in real time.
NXP’s new i.MX 93W addresses this need by integrating scalable edge compute, AI acceleration, and secure wireless connectivity in a single package, supported by NXP’s software, eIQ AI enablement and pre-certified reference designs. This allows coordinated AI agents to locally manage physical environments, such as a group of healthcare agents working together to coordinate wearables, smart diagnostics, sensors and health gateways that deliver real-time healthcare insights and actions. The highly integrated i.MX 93W SoC also allows customers to rapidly scale physical AI across healthcare devices, smart building controllers, industrial gateways, energy infrastructure monitors and smart home hubs.
“With the i.MX 93W, we’re extending the i.MX 9 family to help customers scale physical AI faster,” said Charles Dachs, Executive Vice President and General Manager, Secure Connected Edge at NXP Semiconductors. “This new platform simplifies integration of AI and secure wireless connectivity, reducing design complexity and allowing customers to more quickly deploy AI agents at the edge.”
Robust Ecosystem Speeds Development
“The new i.MX 93W SoC is an exciting addition to the i.MX portfolio, combining powerful application processing, integrated AI acceleration and secure wireless connectivity in a highly compact SiP architecture," said Andreas Kopietz Dipl.-Ing., Sales Manager, F&S Elektronik Systeme. "For embedded developers, the combination of the i.MX 93 applications processor with integrated Wi-Fi® 6, Bluetooth® LE, Thread and Zigbee significantly simplifies system design and certification. This allows our customers to reduce development effort, lower certification costs and accelerate time-to-market for connected HMI, industrial and IoT devices.”
“As smart IoT gateways and edge-connected devices continue to scale, developers need production-ready platforms with strong wireless performance, security, and power efficiency,” said Ahmed Shameem, Associate Director of System on Modules at iWave. “By offering the i.MX 93W as a fully integrated System on Module with built-in Wi-Fi 6 tri-radio connectivity, we are helping to simplify design, reduce development risk and accelerate time-to-market for next-generation industrial and smart IoT products and applications."
"Vantron is proud to collaborate closely with NXP to bring advanced embedded intelligence to industrial automation,” said Bo Wei, CEO at Vantron Technology.
“As a highly integrated SiP platform combining application processing and Wi-Fi connectivity, i.MX 93W simplifies system design and reduces development and certification efforts. This integration enables our customers to accelerate time-to-market, optimize overall system cost, and deploy robust, secure solutions for the demanding environments of machinery manufacturing, while ensuring long-term operational reliability.”
Integrated Scalable Compute and Secure Connectivity Deliver Physical AI
The i.MX 93W applications processor combines a dedicated AI NPU with secure tri-radio wireless connectivity in a single package. This eliminates the need for up to 60 discrete components, significantly reducing board area, design and supply chain complexity and system-level costs. The i.MX 93W features a dual-core Arm® Cortex®A55 applications processor with a dedicated Arm Ethos NPU capable of up to 1.8 eTOPs. The integrated IW610 tri-radio combines Wi-Fi 6, Bluetooth Low Energy, and 802.15.4 connectivity supporting Matter and Thread deployments. This eliminates complex RF tuning steps and coexistence challenges that traditionally slow development and certification, speeding time-to-market.
Security by Design with EdgeLock Secure Enclave
The i.MX 93W SoC integrates an EdgeLock Secure Enclave (Advanced Profile), addressing regulatory requirements, including European Cyber Resilience Act (CRA). The embedded EdgeLock Secure Enclave is a hardware root of trust simplifying implementation of security-critical functions like secure boot, secure update, device attestation and secure device access. Combined with NXP’s EdgeLock 2GO key management services, OEMs can securely provision i.MX 93W SoC-based products at device manufacturing or in the field.
Pre-Certified Reference Designs Speed Time-to-Market
NXP’s pre-certified i.MX 93W SoC-based single and dual-antenna reference designs minimize RF tuning effort and eliminating many common integration challenges. Certified across multiple countries and regions, these reference designs reduce the complexity, cost and risk traditionally associated with RF design and wireless certification. By leveraging validated antenna options and pre-approved designs, customers can shorten regulatory approval timelines, reduce development cost, and bring products to market faster.
Availability
The i.MX 93W is expected to begin sampling in 2H 2026. For more information, please visit NXP.com/iMX93W.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP's "Brighter Together" approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of $12.27 billion in 2025. Find out more at www.nxp.com.
EdgeLock, NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All rights reserved. © 2026 NXP B.V
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/fd0bf1fa-1dc2-4dfc-a2e6-907143b13961
For more information, please contact:Americas & EuropePhoebe FrancisTel: +1 737-274-8177Email: phoebe.francis@nxp.comGreater China / AsiaTel: +86 21 2205 2690Email: ming.yue@nxp.com
FAQ**
How does the integration of the AI NPU and tri-radio connectivity in the i.MX 93W applications processor by NXP Semiconductors N.V. (NASDAQ: NXPI) enhance the performance of physical AI applications compared to traditional solutions?
What specific benefits do the pre-certified reference designs of the i.MX 93W provide to developers in terms of reducing RF design complexity and accelerating time-to-market for NXP Semiconductors N.V. (NASDAQ: NXPI) products?
In what ways does the EdgeLock Secure Enclave implemented in NXP Semiconductors N.V. (NASDAQ: NXPI)’s i.MX 9SoC address security challenges and regulatory requirements in connected devices?
How does the i.MX 93W applications processor's capability to replace up to 60 discrete components align with the current trends in reducing system-level costs and increasing design efficiency in the semiconductor industry, particularly for NXP Semiconductors N.V. (NASDAQ: NXPI)?
**MWN-AI FAQ is based on asking OpenAI questions about NXP Semiconductors N.V. (NASDAQ: NXPI).
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