ST introduces new image sensors for industrial automation, security and retail applications
MWN-AI** Summary
On October 20, 2025, STMicroelectronics (NYSE: STM) unveiled a family of four new 5MP CMOS image sensors tailored for industrial automation, security, and retail applications. The models, identified as VD1943, VB1943, VD5943, and VB5943, are part of the ST BrightSense series and promise optimized image capture featuring high speed and detail, all within a single product rather than relying on two separate chips. This innovation positions STMicroelectronics as a leader in advanced imaging solutions for diverse sectors including machine vision, biometric identification, and automated retail.
The sensors are designed leveraging ST's acclaimed optical sensing technology, highlighting dual global and rolling shutter modes that enhance image capture quality. This unique architecture enables artifact-free video recording alongside low-noise detailed imaging, making these sensors particularly suited for high-speed automated manufacturing and precise object tracking.
Each sensor features a compact 2.25µm pixel design, created with advanced 3D stacking technology that contributes to an impressive pixel array-to-die surface ratio. Additionally, the on-chip RGB-IR separation enhances functionality by eliminating the need for extra components, facilitating simpler system designs.
Incorporating state-of-the-art pixel technologies such as backside illumination (BSI), the sensors boast remarkable sensitivity in varied lighting conditions. They also support advanced imaging capabilities like single-frame on-chip HDR, ensuring high-quality outputs across contrasting light conditions.
With the projected image sensor market expected to reach $3.9 billion by 2030, driven by advancements in functions like low-light performance and on-chip intelligence, STMicroelectronics is poised to lead this innovation. The sensors are currently available for evaluation, with mass production slated for February 2026, showcasing the company's commitment to advancing optical sensing technologies in industrial and security contexts.
MWN-AI** Analysis
STMicroelectronics (NYSE: STM) has launched a new range of 5MP image sensors—VD1943, VB1943, VD5943, and VB5943—targeting industrial automation, security, and retail applications. This innovative product family, with features like hybrid global and rolling shutter capabilities, emphasizes high-speed, low-noise, and high-detail imaging, catering specifically to the requirements of advanced machine vision and real-time tracking.
Market opportunities for these sensors appear compelling as industries increasingly turn toward automation and intelligent surveillance. The projected growth of the image sensor market to $3.9 billion by 2030, according to Yole Group, indicates a robust demand. Companies in sectors such as robotics, security, and smart retail can leverage these sensors for improved functionalities, including biometric identification and automated inventory management. The added benefits of advanced 3D stacking and a compact 2.25µm pixel design further enhance integration within space-constrained systems, making these sensors an appealing choice for developers.
Investors should note that STMicroelectronics, as an established leader in the semiconductor domain, continues to expand its technological footprint in the image sensor market. This growth aligns with global demands for enhanced imaging solutions, driven by the rise of AI and machine learning applications in industrial settings. The ability to deliver high-resolution imaging with minimal motion artifacts signifies a competitive advantage over traditional imaging solutions.
Given this landscape, investors might consider STMicroelectronics as a potential growth stock. The planned mass production set for February 2026 positions the company well to capitalize on emerging market trends. Coupled with its commitment to sustainability and innovation, STMicroelectronics could offer significant long-term returns as industries adapt and evolve to embrace advanced vision technologies.
**MWN-AI Summary and Analysis is based on asking OpenAI to summarize and analyze this news release.
ST introduces new image sensors
for industrial automation, security and retail applications
- Four new 5MP image sensors allow customers to optimize image capture with high speed, high detail with a single, flexible product instead of two chips
- New device family is ideal for high-speed automated manufacturing processes and object tracking
- New sensors leverage market-leading technology for both global and rolling shutter modes, with a compact 2.25µm pixel with advanced 3D stacking, and on-chip RGB-IR separation
Geneva, Switzerland – October 20, 2025 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new family of 5MP CMOS image sensors: VD1943 , VB1943 , VD5943 , and VB5943 . These advanced ST BrightSense sensors are designed to accelerate the development of innovative vision applications across industries, including advanced industrial automation with enhanced machine and robotic vision, next-generation security including biometric identification and traffic management, and smart retail applications such as inventory management and automated checkout. A longtime leader in optical sensing technology for consumer applications, ST continues to expand its offering for new applications with its industry-leading design, 3D stacking expertise and high-volume manufacturing for market-leading performance.
“Our new image sensors with hybrid global and rolling shutter modes allow our customers to optimize image capture, ensuring motion-artifact-free video capture and low-noise, high-detail imaging at the same time, making it ideal for high-speed automated manufacturing processes and object tracking . This architecture is unique on market today and provides unmatched flexibility, performance, and integration. We continue to broaden our portfolio of solutions for a wide range of industrial applications and want to bring the best of optical sensing technologies to both existing and new applications,” said Alexandre Balmefrezol, Executive Vice President and General Manager of STMicroelectronics’s Imaging Sub-Group.
"Industrial and security imaging are pushing sensor performance to new levels, enabling functions from identification to robotic guidance, gauging and advanced monitoring and inspection,” said Florian Domengie, PhD Principal Analyst Imaging at Yole Group . “By 2030, this image sensor market is projected to reach $3.9 billion with over 500 million units shipped. Key advances will include enhanced low-light performance, on-chip intelligence, and hybrid global/rolling shutter operation, combining low noise with high-precision temporal sensing."*
*Source: Status of the CMOS Image Sensor Industry 2025 – 3D Imaging & Sensing 2025, Yole Group
Technical notes
The VD1943, VD5943, VB1943, and VB5943 sensors, part of the ST BrightSense portfolio, are ready for evaluation and sampling, with mass production scheduled to begin in February 2026. Detailed documentation, evaluation kits, and product samples, are available through the local ST sales representative or an authorized distributor.
| Product code | Chroma | Package |
| VD5943 | Monochrome | Sensor die |
| VB5943 | Monochrome | OBGA sensor |
| VD1943 | RGB-IR | Sensor die |
| VB1943 | RGB-IR | OBGA sensor |
Dual global and rolling shutter modes
The sensors provide hybrid global and rolling shutter modes, allowing developers to optimize image capture for specific application requirements. This functionality ensures motion-artifact-free video capture (global shutter) and low-noise, high-detail imaging (rolling shutter), making it ideal for high-speed object tracking and automated manufacturing processes.
Compact design with advanced pixel technology
Using 2.25 µm pixel technology and advanced 3D stacking, the sensors deliver high image quality in a smaller footprint. The die size is 5.76 mm by 4.46 mm, with a package size of 10.3 mm by 8.9 mm, and an industry-leading 73%-pixel array-to-die surface ratio. This compact design enables integration into space-constrained embedded vision systems without compromising performance.
On-chip RGB-IR separation
The RGB-IR variants of the sensors feature on-chip RGB-IR separation, eliminating the need for additional components and simplifying system design. This capability supports multiple output patterns, including 5MP RGB-NIR 4x4, 5MP RGB Bayer, 1.27MP NIR subsampling, and 5MP NIR smart upscale, with independent exposure times and instant output pattern switching. This integration reduces costs while maintaining full 5MP resolution for both color and infrared imaging.
Enhanced imaging performance
The sensors incorporate backside illumination (BSI) and capacitive deep trench isolation (CDTI) pixel technologies to enhance sensitivity and sharpness, particularly in low lighting conditions. Single-frame on-chip HDR improves detail visibility across bright and dark areas. These features enable high-quality imaging in challenging environments and support advanced machine vision and edge AI applications.
About STMicroelectronics
At ST, we are 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027.
Further information can be found at www.st.com .
INVESTOR RELATIONS
Jérôme Ramel
EVP Corporate Development & Integrated External Communication
Tel: +41.22.929.59.20
jerome.ramel@st.com
MEDIA RELATIONS
Alexis Breton
Corporate External Communications
Tel: +33.6.59.16.79.08
alexis.breton@st.com
Attachments
- P4728D -- Oct 20 2025 -- New BrightSense image sensors_FINAL FOR PUBLICATION
- ST BrightSense_vd1943-vd5943-product-illustration
FAQ**
How does STMicroelectronics STMEF plan to leverage the unique hybrid global and rolling shutter modes of their new 5MP image sensors to capture market share in industrial automation and security applications?
What strategies will STMicroelectronics STMEF employ to promote the advanced 3D stacking technology used in their new image sensors to potential customers in the smart retail sector?
In what ways does STMicroelectronics STMEF anticipate that the compact design and high pixel density of their new sensors will address challenges in embedded vision systems?
How does the introduction of on-chip RGB-IR separation in the new image sensors position STMicroelectronics STMEF against competitors in the rapidly evolving imaging technology market?
**MWN-AI FAQ is based on asking OpenAI questions about Stmicroelectronics (OTC: STMEF).
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