MCNEX Launches Industry's First Automotive-Grade QHD Front-and-Rear Cameras over Unshielded Cables & Connectors, Based on Valens Semiconductor's VA7000 A-PHY Chipsets
MWN-AI** Summary
MCNEX has made a significant advancement in automotive technology by introducing the industry's first automotive-grade QHD (2560×1440) front and rear cameras that operate over unshielded twisted pair (UTP) and low-cost coaxial cables. This innovative product, developed in partnership with Valens Semiconductor, utilizes Valens’ VA7000 A-PHY chipsets to facilitate high-resolution imaging while reducing the complexity and cost associated with wiring harnesses in vehicles.
The use of unshielded cables is particularly advantageous for automotive original equipment manufacturers (OEMs), allowing for simplified installations in interior Advanced Driver-Assistance Systems (ADAS) and autonomous vehicle applications. This development not only lowers costs but also ensures high-quality imaging necessary for safety and functionality in modern vehicles.
Additionally, MCNEX is also launching a 4K rear camera that operates over shielded cabling, enabling smoother video output at 60 frames per second. The VA7000 A-PHY chipsets leverage the MIPI A-PHY standard, providing robust performance with multi-gigabit link speeds, which enhances the overall vehicle experience and safety.
Industry representatives from both MCNEX and Valens Semiconductor emphasize the necessity for automotive solutions that seamlessly blend advanced technology with cost efficiency. As automakers strive for higher sensor resolutions and improved data transmission without escalating costs, this partnership aims to meet these emerging demands effectively.
Both MCNEX and Valens Semiconductor are well-positioned as leaders in their respective fields, with MCNEX being recognized for its innovative imaging solutions and Valens for its high-performance connectivity technology. Their collaboration reflects a commitment to advancing automotive safety and technology at a time when the demand for sophisticated vehicle systems continues to grow. With the first OEM vehicle production anticipated in early 2027, the future of automotive camera technology looks promising.
MWN-AI** Analysis
The recent launch by MCNEX and Valens Semiconductor of the automotive-grade QHD front-and-rear cameras leveraging the VA7000 A-PHY chipsets introduces significant technological advancement in the automotive industry. This move not only positions MCNEX as a pioneer in the integration of advanced camera systems but also allows automotive OEMs to embrace cost-effective solutions by utilizing unshielded twisted pair (UTP) and low-cost coaxial cables.
From an investment perspective, this innovation is expected to enhance the value proposition of both MCNEX and Valens. The capability to reduce wiring harness complexity and associated costs while delivering high-resolution imaging for advanced driver-assistance systems (ADAS) presents a compelling case for OEMs looking to adopt new technologies without the typical financial burden. The anticipated production of these new solutions for vehicles in early 2027 aligns well with the industry's gradual shift towards higher-resolution imaging and autonomous driving features, which can act as a catalyst for growth.
Investors should consider the broader implications of this technology on the automotive supply chain. The integration of high-bandwidth capabilities through simpler cabling allows for more flexible interior designs and the potential reduction of overall vehicle weight, a critical factor for manufacturers addressing emissions standards. Additionally, firms heavily invested in ADAS technologies stand to benefit from this collaboration, as these camera systems meet the industry's growing demand for enhanced safety features.
As the market for ADAS and autonomous vehicles is projected to grow substantially in the upcoming years, both MCNEX and Valens Semiconductor appear well-positioned to capture a share of this expanding market. Therefore, investors should closely monitor these companies as they align with technological trends that are likely to shape the future of vehicle dynamics and safety solutions.
**MWN-AI Summary and Analysis is based on asking OpenAI to summarize and analyze this news release.
MCNEX Launches Industry's First Automotive-Grade QHD Front-and-Rear Cameras over Unshielded Cables & Connectors, Based on Valens Semiconductor's VA7000 A-PHY Chipsets
PR Newswire
The cameras allow OEMs to reduce harness cost by operating over the simplest channels, including UTP and low-cost Coax, while retaining high-resolution imaging; MCNEX also introduces to market a 4K rear camera based on A-PHY
SEOUL, South Korea and HOD HASHARON, Israel, Feb. 18, 2026 /PRNewswire/ -- MCNEX and Valens Semiconductor (NYSE: VLN) today announced the joint development and availability of a new family of high–resolution front and rear automotive cameras that deliver QHD (2560×1440) video over unshielded twisted pair (UTP) or low-cost Coax channels, powered by Valens' VA7000 A–PHY chipsets. The cameras enable OEMs to significantly reduce the cost and complexity of their wiring harness while retaining high image quality for ADAS and autonomous applications.
Unshielded cables and connectors present an attractive wire harness option for automotive OEMs, especially for interior ADAS applications such as front and rear cameras mounted inside the vehicle cabin; the Valens' VA7000 delivers multi-gig link speeds over these simple channels. By leveraging the high bandwidth and EMC robustness of the VA7000, based on the MIPI A-PHY standard technology, the MCNEX modules deliver reliable multigigabit performance over simple cables, making them ideal for next-generation front and rearview camera designs in cost-sensitive, high-volume vehicle platforms.
MCNEX is also releasing to market a new 4K, 60fps rear view camera that operates over shielded cabling, based on the Valens VA7000. These chipsets are already in mass production, with the first OEM vehicle production (SoP) expected in early 2027.
"MCNEX has a long history of delivering advanced imaging solutions to leading global automakers, and these new cameras are a natural next step in that journey," said Young Hyun Jeong, VP, Automotive BU at MCNEX. "By combining our camera expertise with Valens Semiconductor's VA7000 chipsets, we are giving OEMs strong options for front- and rear-facing cameras, and we're looking forward to sharing these solutions with our OEM customers and partners."
"Automakers are under pressure to increase sensor resolution and data bandwidth while controlling cost, weight, and most importantly, ensuring flawless performance and passenger safety," said Adar Segal, Head of Automotive Business at Valens Semiconductor. "The collaboration with MCNEX showcases how our VA7000 chipsets, based on MIPI A–PHY technology, enables multi–gigabit, long–reach links over the simplest cabling, including UTP and low-cost Coax. This offering will help OEMs scale to next–generation ADAS systems with higher image quality and more flexible cabling topologies."
About MCNEX
MCNEX is a leading global supplier of automotive camera modules and imaging solutions. The company develops and manufactures advanced camera systems for ADAS and autonomous driving applications, serving major automotive OEMs and Tier 1 suppliers worldwide. MCNEX is known for its expertise in optical design, image processing, and automotive-grade manufacturing. For more information, visit https://www.mcnex.com/.
About Valens Semiconductor
Valens Semiconductor (NYSE:VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit https://www.valens.com/.
Forward-Looking Statements
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Press Contacts
Yoni Dayan
Head of Communications
Valens Semiconductor Ltd.
Yoni.dayan@valens.com
Mark Prindle
Senior Account Executive
Fusion PR
Mark.prindle@fusionpr.com
Investor Contacts
Michal Ben Ari
Investor Relations Manager
Valens Semiconductor Ltd.
michal.benari@valens.com
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SOURCE Valens Semiconductor
FAQ**
How does the partnership with Valens Semiconductor Ltd. (NYSE: VLN) enhance MCNEX's competitive position in the automotive camera market compared to other companies in the same sector?
What specific cost reductions can automotive OEMs expect from using MCNEX's QHD front-and-rear cameras powered by Valens Semiconductor Ltd. VLN's VA7000 chipsets?
How does the use of unshielded twisted pair (UTP) and low-cost Coax channels impact the performance and reliability of the cameras developed in collaboration with Valens Semiconductor Ltd. VLN?
What are the key features of the new rear camera from MCNEX, and how does it compare to existing products in terms of technology and integration potential with Valens Semiconductor Ltd. VLN's chipsets?
**MWN-AI FAQ is based on asking OpenAI questions about Valens Semiconductor Ltd. (NYSE: VLN).
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