TECH - Semiconductor Packaging: Key to US Tech Leadership in AI Says Cadence CEO | Benzinga
According to Anirudh Devgan, CEO of Cadence Design Systems Inc (NASDAQ: CDNS), semiconductor packaging is the key to U.S. leadership in emerging technologies like artificial intelligence.
While sophisticated chip packaging has helped companies like Nvidia Corp (NASDAQ: NVDA) develop AI accelerators, a limited number of suppliers are now causing bottlenecks.
As computational demands increase and advanced chips become more expensive due to smaller transistors, working with three-dimensional structures and overcoming physical limitations is essential, Bloomberg reports.
Taiwan Semiconductor Manufacturing Company Ltd (NYSE: TSM) leads ...