TECH - TSMC Eyes Strategic Packaging Capacity Boost in Arizona as Semiconductor Packaging Challenges Persist | Benzinga

According to Governor Katie Hobbs, Taiwan Semiconductor Manufacturing Co (NYSE: TSMC) is in discussions with Arizona authorities to add advanced chip packaging capacity at its plants in the state. 

This move comes as packaging becomes a bottleneck in semiconductor production, particularly for high-demand products like Nvidia Corp's (NASDAQ: NVDA) AI accelerators. 

TSMC has committed to expanding packaging capacity in Taiwan, but supply constraints will likely persist for another 18 months, Bloomberg Full story available on Benzinga.com