TECH - What's Going On With Taiwan Semi Stock Thursday? | Benzinga
Taiwan Semiconductor Manufacturing Co (NYSE:TSM) is reportedly exploring a new method of advanced chip packaging to meet the growing AI-driven demand for computing power.
The key Nvidia Corp (NASDAQ:NVDA) and Apple Inc (NASDAQ:AAPL) supplier is collaborating with equipment and material suppliers on this new technique, which could take several years to commercialize.
The innovation involves using rectangular panel-like substrates instead of the traditional round wafers, enabling more chip sets per substrate, the Nikkei Asia reports. TSMC stock is trading higher Thursday.
The rectangular substrates under trial minimize unused space, presenting a significant technical shift for TSMC. The transition will ...