KLAC - KLA's Leadership In Booming Advanced Packaging Inspection Is Strengthened By Its Orbotech Acquisiton
KLA’s (KLAC) February 2019 acquisition of Orbotech and its SPTS division expand's the company's product line by including processing equipment. A key piece of this equipment is used in the production of advanced packages to house semiconductor chips prior to insertion into end applications with small form factors dictating smaller packages.
Advanced packaging schemes range from rapidly growing Fan-Out Wafer Level Packaging (FOWLP) to the most advanced "3D-IC" packages. In the latter, two or more die, potentially for different functions, are stacked and connected in the vertical direction with through-silicon vias (TSV) filled