A recent teardown analysis has revealed that Huawei Technologies’ latest high-end smartphone, the Pura 70 series, incorporates more components from Chinese suppliers.
What Happened: The Pura 70 series, released by Huawei in late April, features a memory chip likely packaged by Huawei’s in-house chip unit HiSilicon, as well as other components from Chinese suppliers, Reuters reported, citing a teardown analysis by online tech repair company iFixit and consultancy firm TechSearch International.
The phone is powered by an advanced processing chipset, the Kirin 9010, also made by Huawei. This chipset is believed to be a slightly improved version of the Chinese-made advanced chip used in U.S.-sanctioned Huawei’s Mate 60 series.
Huawei is expected to follow it up with the Mate 70 series, scheduled to ...